Integrated circuits’ arrangement

Integrated circuits’ ranging



Microelectronics is justly considered a dynamically proceeding sphere of radio electronics in the modern universe. The subject of this domain is the microminiaturization of radio-electronic devices. The primary task of the mentioned direction’s collaborators is to reduce the volume of such facilities, the specific weight, and in parallel - to increase its durability, economical application of resources and improve safety.

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First-class integrated circuits



The dynamics of the growth of todays microelectronics can be monitored in three directions - the progress of micromodules, the creation of integrated circuits and building of functional instruments. Taking into account the micromodular design tactic, circuits are assembled using miniature-sized parts. These are transistors, resistors, diodes, capacitors. Ready-made micromodules can be plane or volume.

The creation of integrated circuits features the process of creating microelectronic solution, which includes active and passive details. The dynamic ones are diodes and transistors, and the passive ones are capacitors and resistors. All of them are electrically fixed to each other and based in one shell.

The progress of functional solutions involves the making of solution that utilizes the solids’ physical treats. Experts use them to reach a number of effects - structuring, amplification and changing of electrical vibrations. Generally, when structuring functional devices, collaborators do not utilize single electrical parts. Their traits are traditionally realized due to intermolecular interactions and volumetric phenomena observed in a solid.



Integrated circuits formed due to the design and technological way serve for joint application and are generally produced in series. For example, these solutions have found their application these days in radio-electronic solutions - their making and repair. According to the level of integration, the entire number of integrated circuits is divided into 4 groups:

• 1 degree includes up to 10 spare parts.
• 2 degree - 11-100 details.
• 3 degree - 101-1000 parts.
• 4 degree - 1001-10000 spare parts.

Considering the functional goal, such facility can inhere to one of the groups – analog or digital.